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Journal Articles

A Development of super radiation-hardened power electronics using silicon carbide semiconductors; Toward MGy-class radiation resistivity

Hijikata, Yasuto*; Mitomo, Satoshi*; Matsuda, Takuma*; Murata, Koichi*; Yokoseki, Takashi*; Makino, Takahiro; Takeyama, Akinori; Onoda, Shinobu; Okubo, Shuichi*; Tanaka, Yuki*; et al.

Proceedings of 11th International Workshop on Radiation Effects on Semiconductor Devices for Space Applications (RASEDA-11) (Internet), p.130 - 133, 2015/11

Journal Articles

Effect of humidity and temperature on the radiation response of SiC MOSFETs

Takeyama, Akinori; Matsuda, Takuma; Yokoseki, Takashi; Mitomo, Satoshi; Murata, Koichi; Makino, Takahiro; Onoda, Shinobu; Tanaka, Yuki*; Kandori, Mikio*; Yoshie, Toru*; et al.

Proceedings of 11th International Workshop on Radiation Effects on Semiconductor Devices for Space Applications (RASEDA-11) (Internet), p.134 - 137, 2015/11

Oral presentation

Effect of high temperature and humidity on dose dependence of charges generated in SiC MOSFETs due to $$gamma$$-ray irradiation

Takeyama, Akinori; Matsuda, Takuma*; Yokoseki, Takashi*; Mitomo, Satoshi*; Murata, Koichi*; Makino, Takahiro; Onoda, Shinobu; Okubo, Shuichi*; Tanaka, Yuki*; Kandori, Mikio*; et al.

no journal, , 

Effect of $$gamma$$-ray irradiation under high temperature and humidity circumstances on the electrical characteristics of Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) was investigated. In the case of irradiation under high humidity circumstance, trapped oxide and interface charges densities generated due to irradiation were smaller than those for irradiation in dry circumstance. It is concluded that humidity circumstance suppressed the degradation of the electrical properties due to irradiation including threshold voltage shift and leakage current.

Oral presentation

Optimum structures for $$gamma$$-ray radiation resistant SiC-MOSFETs

Takeyama, Akinori; Mitomo, Satoshi*; Matsuda, Takuma*; Murata, Koichi*; Yokoseki, Takashi*; Makino, Takahiro; Onoda, Shinobu; Oshima, Takeshi; Okubo, Shuichi*; Tanaka, Yuki*; et al.

no journal, , 

Oxide thickness dependence of $$gamma$$-ray irradiation response on Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) was investigated. As a result of irradiation, the threshold voltage V$$_{th}$$ for both SiC MOSFETs with gate oxide of 30 nm or 60 nm thick shifted to negative voltage-side gently. However, the V$$_{th}$$ for 60 nm thick more immediately decreased over 400 kGy. It is found that SiCMOSFETs with smaller thickness has a higher radiation tolerance.

Oral presentation

Influence of gate bias on $$gamma$$-ray radiation response of SiC MOSFETs

Takeyama, Akinori; Murata, Koichi*; Mitomo, Satoshi*; Matsuda, Takuma*; Yokoseki, Takashi*; Makino, Takahiro; Onoda, Shinobu; Okubo, Shuichi*; Tanaka, Yuki*; Kandori, Mikio*; et al.

no journal, , 

Deterioration of electrical property of SiCMOSFETs due to irradiation was reduced compared with no biased ones, when the SiC MOSFETs with switching bias were irradiated. In order to clarify this mechanism, SiCMOSFETs were irradiated up to 50 kGy with switching bias applied to gate oxide from 4.5 to 0 V. As a result, the large negative shift of threshold voltage V$$_{th}$$ due to irradiation with positive bias significantly recovered in the cases that the bias switched to zero. It shows electrical property of SiCMOSFETs were immediately relieved when applied bias was removed by switching.

Oral presentation

Reliability issues in Nitrided SiC MOS devices

Kobayashi, Takuma*; Nakanuma, Takato*; Suzuki, Asato*; Sometani, Mitsuru*; Okamoto, Mitsuo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

no journal, , 

We investigated the reliability of nitrided SiC MOS devices in terms of oxide leakage and flatband voltage stability. Although nitrided MOS devices on non-basal planes are known to have superior on-state performances, we found that the nitridation not only leads to pronounced oxide leakage but also hampers the flatband voltage stability in response to electron and hole injection. In the presentation, we will show how the nitridation modifies the MOS interfaces based on the results of synchrotron radiation X-ray photoelectron spectroscopy and discuss the possible cause of reliability degradation.

Oral presentation

Nitridation-induced degradation of SiC (1-100) MOS devices

Kobayashi, Takuma*; Nakanuma, Takato*; Suzuki, Asato*; Sometani, Mitsuru*; Okamoto, Mitsuo*; Yoshigoe, Akitaka; Shimura, Takayoshi*; Watanabe, Heiji*

no journal, , 

Together with a standard NO nitridation, a high channel mobility ($$sim$$ 100 cm$$^{2}$$V$$^{-1}$$s$$^{-1}$$) is obtained for SiC MOSFETs fabricated on non-basal planes, such as (1-100) m-face. Since these planes appear on the side wall of trench formed on (0001) Si-face, they can be directly applied to trench MOSFETs which have low on-resistance. Despite their advantages, the characteristics of MOS devices on non-basal planes, including the impact of nitridation, is not well investigated. In this work, we focused on SiC MOS devices on m-face and studied their physical and electrical characteristics in detail.

Oral presentation

Improvement of interface and insulating properties of sputter-deposited SiO$$_{2}$$/GaN MOS structures by oxygen and hydrogen annealing

Onishi, Kentaro*; Kobayashi, Takuma*; Mizobata, Hidetoshi*; Nozaki, Mikito*; Yoshigoe, Akitaka; Shimura, Takayoshi*; Watanabe, Heiji*

no journal, , 

GaO$$_{x}$$ interlayer at SiO$$_{2}$$/GaN interfaces is easily reduced during the annealing process, leading to threshold voltage instability of MOS devices. In this study, we formed SiO$$_{2}$$ by sputter deposition to minimize the growth of unstable GaO$$_{x}$$ interlayer. Furthermore, by performing oxygen and hydrogen annealing, a stable GaN MOS structure with good interface and insulating properties was realized.

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